1.Application:
This application Bluetooth .. Chip Antenna .
2.Part Number:
| Type |
Antenna L*W
Dimensions
(mm) |
Frequency
MHZ |
Series
Type |
Special
Code |
S:SMD Chip
F:Film
M:Metal |
2012 : 2.0*1.2
3216: 3.2*1.6
5025: 5.0*2.5 |
Center Frequency
1: 2.4 5 GHZ |
Series No
M: Monopole
C: Coupling |
Special Code
R0:
RoHS
+
Rev : 0 |
3. Electrical Specification:
| ITEM |
Specification |
| Frequency Band MHZ |
2400 - 2500 |
| VSWR |
< = 2.5 |
| Impedance (Ω) |
50 |
| Polarization |
Linear |
| Peak Gain (dBi) |
0.5 dBi |
| Peak Efficiency % |
65% |
| Test Condition |
Test Board Size 50x50 mm |
| Matching Circuit |
Pi Matching Cir Cuit Will Be Required. |
百展科技有限公司 BJTEK NAVIGATION ,INC.
2F., No.129, University Rd., Sanxia Dist., New Taipei City 23741, Taiwan
23741新北市三峽區大學路129號2F.
Tel: +886-2-86720160 Fax: +886-2-86720161Website: www.bjtek.com.tw |
| Part Number: BJSF-2012-1CR0 |
APPROVED BY |
Lotus |
SPEC REV. |
| A0 |
4. Antenna Dimensions:
Recommend Solder Pad Dimensions：Unit:mm
| Type |
W |
D |
L |
| 2012 |
1.30 |
1.15 |
3.50 |
Dimension and Construction
| Type |
L |
W |
T |
P |
| 2012 |
2.00±0.10 |
1.25±0.20 |
0.50±0.20 |
0.30±0.20 |
5. Recommended PC Board Layout (mm):
6. Electrical Characteristics :
Return Loss
VSWR
| Mark |
Frequency (MHZ) |
VSWR |
| 1 |
2420 |
1.6483 |
| 2 |
2450 |
1.1155 |
| 3 |
2480 |
1.6282 |
7. PACKAGING
7.1 Packaging Information
7.2 Dimen sions
| TYPE |
SIZE |
A |
ØB |
ØC |
ØD |
W |
ØM |
| 2012 |
7" |
5K/Reel |
2.0±0.5 |
13.5±1.0 |
21±1.0 |
60±1.0 |
11.5±2.0 |
178±2.0 |
7.3 Tapping Specification
unit:mm 
7. 4 Reel Dimensions :
unit:mm
| Packaging |
Type |
A |
B |
W |
E |
F |
G |
H |
T |
ØD |
P |
| Paper Type |
2012 |
1.55
±0.2 |
2.30
±0.2 |
8.0
±0.2 |
1.75
±0.1 |
3.5
±0.05 |
4.0
±0.1 |
2.0
±0.05 |
0.75
±0.1 |
1.50
±0 10 |
4.0
±0.1 |
Packing Material Data/Storage Data
■Front & Back Lead Dimension
■Top Adhesive Peel Off Strength : 10~70g
8. Storage A nd Pack age
■Package
■ Storage Data :
Storage time at the environment temp: 25+5°C & humidity: 60±20% is valid for one year from the date of delivery
9. Reliability Test and Requiremen
| Test Item |
Procedure |
Requirements
Ceramic Type |
Remark
(Reference) |
| Electrical Test |
|
Open |
User Spec |
| Soldering Heat |
260 ± 5°C For 10 Seconds |
No Visible Damage |
JIS C 5201-1 |
| Board Flex(SMD) |
Bending once for 60 seconds |
No Visible Damage |
AEC-Q200 005 |
| IR Reflow |
 |
In accordance with specification |
Sony SS-00254 |
| Physical Dimension |
Any applicable method using x10 magnification, micrometers, calipers, gauges, contour projectors, or other measuring equipment, capable of determining the actual specimen dimensions. |
In accordance with specification |
JESD22 JB100 |
